Receptacle for connecting to flexible circuit board

ABSTRACT

Connector receptacles that may be space efficient and provide a direct connection to a flexible circuit board. One example may provide an electronic device having a receptacle including a recess formed in a housing of the electronic device. The recess may have a sidewall and a bottom surface portion, and the bottom surface portion may include one or more openings extending through the bottom surface portion from an external surface to an internal surface. One or more contacts formed on a flexible circuit board may be aligned with the one or more openings in the bottom surface portion. In this way, the receptacle may be space efficient and provide a direct connection to a flexible circuit board inside an electronic device. A cosmetic cap may be placed in the recess to obscure the existence of the connector receptacle.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/888,545, filed Feb. 5, 2018, which is a continuation of U.S. patentapplication Ser. No. 14/641,316, filed Mar. 7, 2015, which claims thebenefit of U.S. provisional patent application No. 62/044,869, filedSep. 2, 2014, which are incorporated by reference.

BACKGROUND

Electronic devices often include one or more connector receptaclesthough which they may provide and receive power and data. This power anddata may be conveyed over cables that may include wire conductors, fiberoptic cables, or some combination of these or other conductors. Cableassemblies may include a connector insert at each end of a cable. Theconnector inserts may be inserted into receptacles in the communicatingelectronic devices.

These receptacles may be a relatively large electrical component havinga housing, shielding, contacts, and other structures. These receptaclesmay have an opening aligned with an opening in an electronic device.These receptacles may be mounted on a printed circuit board such as amain logic or motherboard.

Accordingly, conventional connector receptacles may be a component thatis manufactured as a separate device, then placed on a printed circuitboard and aligned with an opening in an electronic device. Electricalpaths for power and data may be formed by conductors in a cable, pins ina connector insert at an end of the cable, pins in a connectorreceptacle, and traces on a printed circuit board.

But these connector receptacles may be relatively large. This may beundesirable since electronic devices are becoming ever smaller overtime. Using a large receptacle may limit how small a device may be made,it may limit the functionality that may be included in the device, or itmay limit both how small a device may be made and the functionality thatmay be included in the device.

Moreover, many smaller devices may not include a printed circuit boarddue to size constraints. These devices may instead include conductivepathways formed of flexible circuit boards or similar structures.

Thus, what is needed are connector receptacles that may be spaceefficient and provide direct connection to flexible circuit boards.

SUMMARY

Accordingly, embodiments of the present invention may provide connectorreceptacles that may be space efficient and provide direct connectionsto flexible circuit boards. An illustrative embodiment of the presentinvention may provide an electronic device having a receptacle formed ina housing of the electronic device. The receptacle may include a recessin the housing. The recess may include a sidewall and a bottom surfaceportion. The bottom surface portion may include one or more openingsextending through the bottom surface portion from an external surface toan internal surface. One or more contacts may be aligned with the one ormore openings in the bottom surface portion. For example, the receptaclemay include a plurality of contacts each aligned with one of theopenings in the bottom surface portion. In various embodiments of thepresent invention, the contacts may be formed on a flexible circuitboard. In this way, the receptacle may be space efficient and provide adirect connection to a flexible circuit board inside an electronicdevice.

Embodiments of the present invention may provide for a high level ofresistance to water leakage. One embodiment of the present invention mayinclude a seal located between an internal surface of the bottom surfaceportion and the flexible circuit board. This seal may be an insulativelayer. This seal may be a flexible layer or gasket and may be formed ofsilicone or other material. This seal may also be formed of an O-ring orsimilar structure. The seal may have one or more openings to allowaccess through the bottom surface portion to the one or more contacts.The seal formed using this flexible layer may be a dust seal, lightseal, particle seal, air seal, water seal, or other type of seal orcombination thereof.

Various embodiments of the present invention may provide mechanicalsupport for the flexible circuit board in various ways. In oneembodiment of the present invention, a bracket may be used to secure aflexible circuit board in place such that contacts on the flexiblecircuit board remain aligned with the one or more openings in the bottomsurface portion. The bracket may be fixed to the bottom surface portion,another portion or portions of the housing, or other structure attachedor associated with the housing. The bracket may be fixed in place usingone or more fasteners or other components. For example, one or morescrews may pass through openings in the bracket into holes in aninternal surface of the bottom surface portion of the housing. One ormore alignment pins may be formed on the bracket and may fit incorresponding holes in the internal surface of the bottom surfaceportion of the housing, another portion or portions of the housing, orother structure attached or associated with the housing. The bracket maybe attached to the flexible circuit board with a layer of adhesive, suchas a pressure sensitive adhesive (PSA), double sided tape, or otheradhesive.

Contacts may be formed on flexible circuit boards in various ways. Inone embodiment of the present invention a flexible circuit board mayinclude a flexible material supporting a first conductive layer. Aportion of the first conductive layer may be exposed and not covered bythe flexible supporting material. A second conductive layer may be overand attached to the first conductive layer. A plating layer may be overthe second conductive layer. A coverlay may be formed over a portion ofthe flexible supporting material and around the first portion of thefirst conductive layer. The coverlay may be covered by an adhesivelayer. A liquid photoimagable layer may be formed over the adhesivelayer. The first conducive layer and the second conductive layer may beattached using a solder layer. The first conductive layer may copper,the second conductive layer may be stainless steel, and the platinglayer may be gold. Additional plating layers of nickel or other materialmay be used as well.

In various embodiments of the present invention, these receptacles maybe used often and may therefore remain accessible to a user. In otherembodiments, these receptacles may be used less frequently. For example,they may be used during software or firmware updates and not used atother times. In these embodiments, a semi-permanent or removablecosmetic caps or cover seal may be placed over the receptacle opening toreduce water leakage and to otherwise protect the flexible circuit boardcontacts. In still other embodiments of the present invention, thisconnector receptacle may be accessible during manufacturing, forexample, only during initial testing or programming. In these variousembodiments of the present invention, a cosmetic cap or cover seal maybe placed in the connector receptacle recess. The cosmetic cap or coverseal may have a surface that is flush with a portion of the deviceenclosure around the connector receptacle. The cosmetic cap or coverseal may be formed of the same material as the device enclosure, or itmay be formed of another material. A layer of adhesive may be used tofix the cosmetic cap or cover seal in place after testing andprogramming is complete. As with the other adhesives discussed herein,this layer may be a layer of pressure sensitive adhesive, double sidedtape, or other adhesive. The cover seal may, as with the flexible layeror piece, form a water seal, a dust seal, light seal, particle seal, airseal, or other type of seal or combination thereof.

The connector receptacles employed by embodiments of the presentinvention may be formed in various ways of various materials. Forexample, a receptacle may include a flexible circuit board. The flexiblecircuit board may include various layers having traces or planes onthem, where the various traces and planes are connected using viasbetween layers. The flexible circuit board may be formed as part of alarger flexible circuit board that may form a logic or motherboard in anelectronic device. In other embodiments of the present invention, theseflexible circuit boards may be formed of conductive or metallic tracesand planes in or on a nonconductive body. The nonconductive body may beformed of plastic or other materials.

In various embodiments of the present invention, enclosures (in somecases), contacts, brackets, power and ground planes, traces, fasteners,and other conductive portions of connector receptacles may be formed bystamping, metal-injection molding, machining, micro-machining, 3-Dprinting, or other manufacturing process. The conductive portions may beformed of stainless steel, steel, copper, copper titanium, phosphorbronze, or other material or combination of materials. They may beplated or coated with nickel, gold, or other material. The nonconductiveportions, such as the enclosures (again, in some cases), siliconegaskets, fasteners and other portions, may be formed using injection orother molding, 3-D printing, machining, or other manufacturing process.The nonconductive portions may be formed of silicon or silicone, rubber,hard rubber, plastic, nylon, liquid-crystal polymers (LCPs), ceramics,or other nonconductive material or combination of materials. Flexiblecircuit boards may be replaced by other substrates, such as printedcircuit boards, in many embodiments of the present invention.

Embodiments of the present invention may provide connector receptaclesthat may be located in, and may connect to, various types of devices,such as portable computing devices, tablet computers, desktop computers,laptops, all-in-one computers, wearable computing devices, cell phones,smart phones, media phones, storage devices, portable media players,navigation systems, monitors, power supplies, adapters, remote controldevices, chargers, and other devices. These connector receptacles mayprovide pathways for signals that are compliant with various standardssuch as Universal Serial Bus (USB), High-Definition MultimediaInterface® (HDMI), Digital Visual Interface (DVI), Ethernet,DisplayPort, Thunderbolt™, Lightning™, Joint Test Action Group (JTAG),test-access-port (TAP), Directed Automated Random Testing (DART),universal asynchronous receiver/transmitters (UARTs), clock signals,power signals, and other types of standard, non-standard, andproprietary interfaces and combinations thereof that have beendeveloped, are being developed, or will be developed in the future. Invarious embodiments of the present invention, these interconnect pathsprovided by these connector receptacles may be used to convey power,ground, signals, test points, and other voltage, current, data, or otherinformation.

Various embodiments of the present invention may incorporate one or moreof these and the other features described herein. A better understandingof the nature and advantages of the present invention may be gained byreference to the following detailed description and the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an exploded view of a connector receptacle accordingto embodiment of the present invention;

FIG. 2 illustrates front views of connector receptacles according toembodiments of the present invention;

FIG. 3 illustrates a side view of an assembled connector receptacleaccording to an embodiment of the present invention;

FIG. 4 illustrates a portion of a connector receptacle according to anembodiment of the present invention;

FIG. 5 illustrates an oblique view of a bracket for a connectorreceptacle according to an embodiment of the present invention;

FIG. 6 illustrates a side view of a contact on a flexible circuit boardaccording to an embodiment of the present invention; and

FIG. 7 illustrates a side cutaway view of a contact according to anembodiment of the present invention.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

FIG. 1 illustrates an exploded view of a connector receptacle accordingto embodiment of the present invention. This figure, as with the otherincluded figures, is shown for illustrative purposes and does not limiteither the possible embodiments of the present invention or the claims.

In this figure, a connector receptacle may be formed in device enclosure110. The receptacle may include a sidewall 112 terminating in anexternal surface 114 of bottom surface portion 117. Bottom surfaceportion 117 may include the external surface 114 and an internal surface118. Bottom surface portion 117 may further include openings 116.

Openings 116 may provide access to contacts 122. Specifically, bottomsurface portion 117 may include one or more openings 116 that extendfrom an external surface 114 to an internal surface 118 of bottomsurface portion 117. The one or more openings 116 may provide access toone or more contacts 122. In a specific embodiment of the presentinvention, openings 116 may include one opening to provide access forone or more contacts 122. In another embodiment of the presentinvention, bottom surface portion 117 may include a number of openings116 each providing access for a corresponding contact 122. Contacts 122may be formed on printed circuit board 120.

In various embodiments of the present invention, it may be desirable toprevent or reduce water leakage through the one or more openings 116into the electronic device enclosed by enclosure 110. In thesesituations, a gasket, O-ring, or similar structure may be used to form aseal. This seal may be a water seal, a dust seal, light seal, particleseal, air seal, or other type of seal or combination thereof. Forexample, an insulative or flexible piece (or silicon gasket) 130 may beincluded. Flexible piece 130 may be a silicone gasket 130. In anembodiment of the present invention, silicone gasket 130 may include anumber of openings 132. In various embodiments of the present invention,silicone gasket 130 may include one opening to provide access to all ofthe contacts 122. In other embodiments of the present invention,silicone gasket 130 may include a number of openings 132, each openingcorresponding to, and providing access to, one of the contacts 122 onthe flexible circuit board 120. Silicone gasket 130 may include a raisedportion or edge 134 to form a seal around an edge of bottom surfaceportion 117. In other embodiments of the present invention, an O-ring orother structure may be used in place of, or in conjunction with,silicone gasket 130.

In various embodiments of the present invention, contacts 122 may beheld in alignment with openings 116 in device enclosure 110 in variousways. For example, brackets, pins, fasteners, or other structures may beused. In this example, bracket 140 may be used to secure printed circuitboard 120 in place relative to openings 116. Specifically, bracket 140may include alignment pins 144 that may mate with corresponding holes(not shown) in internal surface 118 of bottom surface portion 117. Whenalignment pins 144 are inserted, fasteners 150 may be passed throughopenings 142 in bracket 140. These screws or fasteners 150 may screwinto threaded holes (not shown) in an internal surface 118 of bottomsurface portion 117. Adhesive 160 may be used to fasten flexible circuitboard 120 to bracket 140 in order to hold bracket 140 in place duringassembly. As with the other adhesives shown herein, layer 160 may be alayer of adhesive, such as a pressure sensitive adhesive, double sidedtape, or other adhesive.

Again, in various embodiments of the present invention, thesereceptacles may be used often and may therefore remain accessible touser. In other embodiments of the present invention, these receptaclesmay be used less frequently. For example, they may be used duringsoftware or firmware updates and not used for other data updates orcharging. In these embodiments of the present invention, asemi-permanent or removable cover or seal may be placed over receptacleopening. This cover may reduce water leakage and otherwise protect theflexible circuit board contacts. In still other embodiments the presentinvention, this connector receptacle may be accessible only by themanufacturer. In these embodiments, the connector receptacle may beuseful during testing, initial programming, or other such activities. Inthis case, a cosmetic cap or cover seal 170 may be fixed morepermanently in the connector receptacle recess. These semi-permanent ormore permanent cosmetic caps or cover seals 170 may have surfaces thatare flush with a portion of the device enclosure around the connectorreceptacle. The cosmetic caps or seals 170 may be formed of the samematerial as the device enclosure 110 or they may be formed of adifferent material. A layer 180 of adhesive may be used to fix thecosmetic cap or cover seal 170 in place after manufacturing. As before,layer 180 may be a layer of adhesive such as a pressure sensitiveadhesive, double sided tape, or other type of adhesive layer. In thisexample, cover seal 170 may be held in place by adhesive layer 180 inthe receptacle recess in enclosure 110. An outside surface of the coverseal 170 may be shaped to fit an outer lip of sidewall 112. Cover seal170 may, as with flexible layer or silicon gasket 130, form a waterseal, a dust seal, light seal, particle seal, air seal, or other type ofseal or combination thereof.

Again, in various embodiments of the present invention, contacts 122 mayremain accessible, or they may be covered either semi-permanently or(more) permanently with a cover or cap. Examples are shown in thefollowing figure.

FIG. 2 illustrates front views of connector receptacles according toembodiments of the present invention. The top receptacle formed inenclosure 110 has a recess having an external surface 114. Openings inexternal surface 114 allow access to contacts 122. The bottom receptacleformed in enclosure 110 has a recess that has been filled with acosmetic cap or cover seal 170.

FIG. 3 illustrates a side view of an assembled connector receptacleaccording to an embodiment of the present invention. Again, deviceenclosure 110 may include a connector receptacle recess formed bysidewalls 112 terminating in external surface 114. The external surface114 may include openings 116 to provide access to contacts 122. Contacts122 may be located on flexible circuit board 120. Flexible circuit board120 may be fixed to bracket 140 with adhesive layer 160. A cosmetic capor cover seal 170 may be attached to bottom surface portion or externalsurface 114 by adhesive layer 180. Cosmetic cap or cover seal 170 mayhelp to prevent water (or other substance) ingress and may protectcontacts 122 from exposure. Silicone gasket or O-ring 130 may be used toform a seal between enclosure 110 and flexible circuit board 120.Silicone gasket 130 may further protect the enclosed device from water(or other substance) leakage.

FIG. 4 illustrates a portion of a connector receptacle according to anembodiment of the present invention. Again, silicone gasket 130 mayinclude a number of openings 132 to provide access to contacts 122.Contacts 122 may be formed on flexible circuit board 120. Siliconegasket 130 may further include a raised edge 134 to engage an edge orlip on an internal surface 118 of bottom surface portion 117. Bracket140 may be used to fix flexible circuit board 120 in place.Specifically, bracket 140 may include alignment pins 144 that may fit inholes in an internal surface 118 of bottom surface portion 117.Fasteners 150 may be inserted through openings 142 and into threadedholes in an internal surface 118 in bottom surface portion 117. In otherembodiments of the present invention, either or both alignment pins 144and fasteners 150 may engage other parts of device enclosure 110, orother structures associated with or attached to device enclosure 110.

FIG. 5 illustrates an oblique view of a bracket for a connectorreceptacle according to an embodiment of the present invention. Bracket140 may include through holes or openings 142 and alignment pins 144.Again, through holes or openings 142 may accept fasteners 150 andalignment pins 144 may fit in openings in an internal surface 118 ofbottom surface portion 117. Bracket 140 may further include pin 510. Pin510 may be used during the assembly process to secure bracket 140 inplace while fasteners 150 are inserted.

Contacts 122 may be formed in various ways in various embodiments of thepresent invention. An example is shown in the following figures.

FIG. 6 illustrates a side view of a contact on a flexible circuit boardaccording to an embodiment of the present invention. In this example,one or more conductive layers 620 may be formed in or on flexible layer610. A portion of a first conductive layer 620 may be exposed andaccessible. That is, a portion of a first conductive layer 620 is notcovered by flexible circuit board material in this example. A secondconductive layer 640 may be placed over and attached to the firstportion of the first conductive layer 620. The first conductive layer620 and second conductive layer 640 may be attached by solder 630. Thesesecond conductive layer 640 may be plated with gold layer 642.

The flexible circuit board 610 may be covered with a coverlay 650.Coverlay 650 may be all or partially covered with adhesive layer 660. Aliquid photoimagable layer 670 may be formed over adhesive 660.

A side view of a contact 122 is shown in the following figure.

FIG. 7 illustrates a side cutaway view of a contact according to anembodiment of the present invention. In this example, the contact may beformed primarily of stainless steel layer 640. Nickel layer 712 may beplated on a surface of the stainless steel layer 640. Nickel layer 712may be tinned with solder layer 720 to form a connection to a conductivelayer in or on a flexible circuit board. A second nickel layer 710 maybe placed on the far side of stainless steel layer 640. Nickel layer 710may be gold plated with gold layer 642 to form a surface of contact 122.

Again, embodiments of the present invention may provide connectorreceptacles that may be located in, and may connect to, various types ofdevices, such as portable computing devices, tablet computers, desktopcomputers, laptops, all-in-one computers, wearable computing devices,cell phones, smart phones, media phones, storage devices, portable mediaplayers, navigation systems, monitors, power supplies, adapters, remotecontrol devices, chargers, and other devices. These connectorreceptacles may provide pathways for signals that are compliant withvarious standards such as Universal Serial Bus (USB), High-DefinitionMultimedia Interface® (HDMI), Digital Visual Interface (DVI), Ethernet,DisplayPort, Thunderbolt™, Lightning™, Joint Test Action Group (JTAG),test-access-port (TAP), Directed Automated Random Testing (DART),universal asynchronous receiver/transmitters (UARTs), clock signals,power signals, and other types of standard, non-standard, andproprietary interfaces and combinations thereof that have beendeveloped, are being developed, or will be developed in the future. Invarious embodiments of the present invention, these interconnect pathsprovided by these connector receptacles may be used to convey power,ground, signals, test points, and other voltage, current, data, or otherinformation.

In a specific embodiment of the present invention, a connectorreceptacle may provide contacts for more than one type of interface. Forexample, contacts for one or more data interfaces, such as a UART, USB,DVI, Ethernet, or other type of data interfaces may be included. Also,contacts for one or more testing interfaces, such as JTAG, DART, or TAPtesting interfaces may be included.

Contacts for power, clock, ground, connect detect, and other types ofcontacts may also be included. In one embodiment, power provided by aninternal battery may be measured at a power pin. Disconnect diodes orother techniques may be used to allow a higher voltage to be provided atthe pin. When a higher voltage is provided, the internal circuitry mayenter a testing, programming, or other mode.

Again, connector receptacles employed by embodiments of the presentinvention may be formed in various ways of various materials. Forexample, a receptacle may include a flexible circuit board. The flexiblecircuit board may include various layers having traces or planes onthem, where the various traces and planes are connected using viasbetween layers. The flexible circuit board may be formed as part of alarger flexible circuit board that may form a logic or motherboard in anelectronic device. In other embodiments of the present invention, theseflexible circuit boards may be formed of conductive or metallic tracesand planes in or on a nonconductive body. The nonconductive body may beformed of plastic or other materials.

Again, in various embodiments of the present invention, enclosures (insome cases), contacts, brackets, power and ground planes, traces,fasteners, and other conductive portions of connector receptacles may beformed by stamping, metal-injection molding, machining, micro-machining,3-D printing, or other manufacturing process. The conductive portionsmay be formed of stainless steel, steel, copper, copper titanium,phosphor bronze, or other material or combination of materials. They maybe plated or coated with nickel, gold, or other material. Thenonconductive portions, such as the enclosures (again, in some cases),silicone gaskets, fasteners and other portions, may be formed usinginjection or other molding, 3-D printing, machining, or othermanufacturing process. The nonconductive portions may be formed ofsilicon or silicone, rubber, hard rubber, plastic, nylon, liquid-crystalpolymers (LCPs), ceramics, or other nonconductive material orcombination of materials. Flexible circuit boards may be replaced byother substrates, such as printed circuit boards, in many embodiments ofthe present invention.

The above description of embodiments of the invention has been presentedfor the purposes of illustration and description. It is not intended tobe exhaustive or to limit the invention to the precise form described,and many modifications and variations are possible in light of theteaching above. The embodiments were chosen and described in order tobest explain the principles of the invention and its practicalapplications to thereby enable others skilled in the art to best utilizethe invention in various embodiments and with various modifications asare suited to the particular use contemplated. Thus, it will beappreciated that the invention is intended to cover all modificationsand equivalents within the scope of the following claims.

What is claimed is:
 1. An electronic device comprising: a deviceenclosure; a connector receptacle located in an opening in the deviceenclosure and comprising: a recess defined by a sidewall, the sidewallaround an opening in a bottom of the recess, the sidewall between theopening in the device enclosure and the bottom of the recess; a board;and a plurality of contacts supported by the board, each contact havinga contacting surface to form an electrical connection, wherein each ofthe contacting surfaces is accessible through the opening in the bottomof the recess; a cover located in the opening in the device enclosure;and a gasket between the opening in the device enclosure and theplurality of contacts.
 2. The electronic device of claim 1 wherein thegasket forms a seal to protect the connector receptacle.
 3. Theelectronic device of claim 1 wherein the cover is curved and is flushwith a surface of the device enclosure.
 4. The electronic device ofclaim 1 wherein the cover is formed of the same material as the deviceenclosure.
 5. The electronic device of claim 1 wherein the board is aflexible circuit board.
 6. The electronic device of claim 5 wherein theflexible circuit board is on a surface of a printed circuit board. 7.The electronic device of claim 5 wherein the flexible circuit board ison a housing, the housing supporting the plurality of contacts.
 8. Anelectronic device comprising: a connector receptacle located in anopening of the electronic device and comprising: a housing forming arecess having a sidewall, the sidewall extending into the electronicdevice, the recess having a bottom opening; a plurality of contacts,each contact having a contacting surface exposed at the bottom openingof the recess; and a flexible circuit board in the bottom opening of therecess, the flexible circuit board supporting the plurality of contacts;and a cover located in the opening of the electronic device.
 9. Theelectronic device of claim 8 further comprising a gasket adjacent to thehousing to seal the connector receptacle.
 10. The electronic device ofclaim 8 further comprising a printed circuit board supporting theplurality of contacts and the flexible circuit board.
 11. The electronicdevice of claim 8 further comprising a bracket supporting the pluralityof contacts and the flexible circuit board.
 12. The electronic device ofclaim 8 further comprising a bracket, the bracket securing the flexiblecircuit board in the bottom opening of the recess.
 13. The electronicdevice of claim 12 wherein the cover is attached to the housing using afirst adhesive layer.
 14. The electronic device of claim 13 wherein thefirst adhesive layer is double-sided tape.
 15. An electronic devicecomprising: a device enclosure, the device enclosure having an opening;a connector receptacle located in the opening in the device enclosureand comprising: a sidewall extending from the opening in the deviceenclosure and forming a bottom opening; a plurality of contacts, eachhaving a contacting surface accessible in the bottom opening; and aflexible circuit board supporting the plurality of contacts; and agasket forming a seal to prevent moisture ingress into the electronicdevice through the connector receptacle.
 16. The electronic device ofclaim 15 wherein the contacting surface of each contact connects to acorresponding contact in a corresponding connector when thecorresponding connector is mated to the connector receptacle, whereineach of the contacting surfaces are between the flexible circuit boardand the opening in the device enclosure.
 17. The electronic device ofclaim 15 further comprising a board supporting the plurality ofcontacts, and a bracket, such that the board is between the bracket andthe opening in the device enclosure.
 18. The electronic device of claim15 wherein the sidewall terminates in a bottom surface, the bottomsurface having the bottom opening.
 19. The electronic device of claim 18further comprising a cover positioned such that the gasket is betweenthe cover and the plurality of contacts.
 20. The electronic device ofclaim 19 wherein the cover is curved and is flush with a surface of thedevice enclosure.